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Job ID : 1536676 Date Updated : April 30th, 2025

PR/158747 | Field Service Engineer

Location Malaysia, Pulau Pinang
Job Type Permanent Full-time
Salary Negotiable, based on experience

Job Description

An established MNC in wafer packaging industry, seeking talented individuals with an innovative mindset to join their Engineering team. You will be a key part of revolutionary in the advanced packaging equipment for automated and high precision manufacturing industries.
 
JOB DESCRIPTIONS
  • Perform troubleshooting, installation, process evaluation, setup, maintenance/preventive maintenance, field modifications, and repair on designated equipment,
  • Order and manage repair part cycle time.
  • Maintain customer service log and internal service records in a timely manner.
  • Maintain daily communication with customers to ensure issue resolution and proper follow up.
  • Maintain tools and test equipment to ensure proper calibration.
  • Adhere to requirements such as HIPPA, OSHA, FDA, etc
JOB REQUIREMENTS
  • Min Bachelor’s Degree in related Engineering field.
  • Min 3 years of working experience as process, field service, or application engineering in semiconductor industries.
  • Experience in thin film deposition, SMT, Cu-RDL / Cu-Pillar, or WLP.
  • Familiar with FMEA, Control Plan, SPC, WI, etc.
  • Possess own transport.
  • Willing and able to travel in short notice.
  • Ability to lift and carry toolbox weighing up to 5lbs.

General Requirements

Minimum Experience Level Over 3 years
Career Level Mid Career
Minimum English Level Business Level
Minimum Japanese Level Business Level
Minimum Education Level Associate Degree/Diploma
Visa Status No permission to work in Japan required

Job Location

  • Malaysia, Pulau Pinang

Work Conditions

Job Type Permanent Full-time
Salary Negotiable, based on experience
Industry Other (Manufacturing)

Job Category

  • Other > Other