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Job ID : 1489133 Date Updated : November 22nd, 2024
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Engineer/Senior Engineer Process Integration

Hiring Company 社名非公開
Location Hiroshima Prefecture
Job Type Permanent Full-time
Salary 4.5 million yen ~ 10 million yen

Job Description

【求人No NJB2238657】
As Technology Development (TD) DRAM Integration Technology department we drive next generation of DRAM memory technology development through multi functional responsibilities of module engineering materials development and device engineering in Hiroshima plant TD!

As the Engineer of Process Integration you will work well with all assigned module related development activities in Fab15 TD but also work with related MFG Process Integration modules developing process flows and process integration schemes with novel devices and new materials for next generation of DRAM as well as finding innovative and manufacturable solutions to enable a successful transitioning of the new DRAM product which is developed in Fab15 TD to the manufacturing sites.
You will ensure maximum partnership and cross・learning between the different sites and organizations.
You will also be a member of the Process R D Project team across the sites (Hiroshima Taiwan and Boise).

■Responsibilities include but are not limited to the following:
・Project responsibilities
・Assume responsibility for all assigned module related transfer topics in F15 R D (including process flow tool selection recipe optimization characterization and data interpretation methods)
・Facilitate x learning and BKM sharing for all related module related topics between global sites/HVM fabrications
・Assure that the right critical metric for inline param probe burn and REL measurements are in place assure appropriate reaction time for deviation and toggles
・Work with Yield Enhancement Process Engineering Real Time Defect Analysis Physical Failure Analysis Param and Quality Assurance teams to understand issues and priorities
・Pro actively address technical issues by proposing solutions and bring up resource conflicting.
・Take an ownership for across module activities and items in the critical path if required.
・Define sub milestones for the project and work with the team to achieve the targets and timelines
・Work with Central Teams Process areas and planning teams to define MOR related activities.
・Individual responsibilities
・Provide technical leadership for all of the related module activities for the lifetime of the project.
・Summarize a comprehensive problem derive and explain actions taken to address them.
・Drive effective multi functional communication on issue for resolution.

General Requirements

Minimum Experience Level No experience
Career Level Mid Career
Minimum English Level Business Level
Minimum Japanese Level Native
Minimum Education Level Technical/Vocational College
Visa Status Permission to work in Japan required

Required Skills

■Qualifications
・ 3 years of Process Integration or Process Development experience.
・Experience for the introduction and yield ramp for at least one DRAM generation.
・Capability to resolve an issue that span multiple groups.
・Ability to think and communicate clearly in urgent and stressed situations.
・Strong understanding of DRAM process flow as well as common Pareto issues.
・Understanding interaction of process and device.
・Previous exposure to transfer or production for at least one memory generation.
・Proficient communication skill in Japanese is a requirement.
・Well understanding of English will be a significant plus.
・Understanding of Chinese would be a plus.

■Education
Master of Science Degree in Electrical Engineering Microelectronics or related subject area is required (unless relevant multi year working expertise rationalizes waiving this requirement)

Job Location

  • Hiroshima Prefecture

Work Conditions

Job Type Permanent Full-time
Salary 4.5 million yen ~ 10 million yen
Work Hours 08:30 ~ 17:15
Holidays 【有給休暇】有給休暇は入社後7ヶ月目から付与されます 入社7ヶ月目には最低10日以上 【休日】完全週休二日制 年末年始 有給休…
Industry Electronics, Semiconductor

Job Category

  • Electronics and Semiconductor Technology > Production Engineering (Electronics and Semiconductor Technology)

Company Details

Company Type International Company