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半導体・MEMS製造装置 装置設計
| Hiring Company | 東証プライム上場企業グループ会社 |
| Location | Hyogo Prefecture |
| Job Type | Permanent Full-time |
| Salary | 7 million yen ~ 12 million yen |
Job Description
【求人No NJB2099768】
■業務内容
装置の機械設計業務。
General Requirements
| Minimum Experience Level | No experience |
| Career Level | Mid Career |
| Minimum English Level | Daily Conversation |
| Minimum Japanese Level | Native |
| Minimum Education Level | Technical/Vocational College |
| Visa Status | Permission to work in Japan required |
Required Skills
※下記いずれかに該当する方 ・装置設計（機械または制御）経験 ・強度設計や公差設計、配管設計の経験。 ・真空装置の経験、Oリングのシール設計。 【歓迎】 半導体製造装置に携わったご経験Job Location
- Hyogo Prefecture
Work Conditions
| Job Type | Permanent Full-time |
| Salary | 7 million yen ~ 12 million yen |
| Work Hours | 09:00 〜 17:30 |
| Holidays | 【有給休暇】初年度 10日 4か月目から 【休日】完全週休二日制 土 日 祝日 GW 夏季休暇 年末年始 |
| Industry | Automobile and Parts |
Job Category
- Electronics and Semiconductor Technology > Production Engineering (Electronics and Semiconductor Technology)
- Machinery and Automobile Technology > Architect, Development Engineer
